High-density interconnect PCBs require a number of different processes that must be done correctly to ensure optimal functionality. These include microvia drilling and sequential lamination. The process also involves copper…

Design Considerations for Flex PCBs Flex PCBs are often used in electronics devices as they help reduce manufacturing costs, weight and space. They are also capable of withstanding high temperatures…

Double-sided PCBs have copper traces and component pads on both sides of the board. Since both sides are surface mount, the same solder paste and component placement processes are used.…

The DFM process can help you find practical solutions to project impediments. This specialized review can identify cost-saving opportunities and reduce lead times without compromising quality. DFM analyses can be…

High-speed PCBs require a close attention to detail when it comes to component placement and routing, thermal considerations, and stackup design. Choosing the right materials and making smart decisions about…